Laser Precision Cutting (LPC)
Bold’s laser precision cutting (LPC) product line is a high-demand system, offering advanced, precise cutting capabilities for materials ranging from thin glass to metals. Our technology doubles production line throughput, with customized machinery tailored to meet the specific needs of your facility.
Benefits and Features
Laser Source Options
Single and dual head fiber laser cutting with laser power options from 500 W to 3 kW to handle metals, ceramics, and polymers.
Precision Stages
Sheet processing with stages from 24”x24” to 48”x48”, as well as customized to meet requirements.
Customized Fixturing & Automation
Bold offers the LPC System with both sheet-feeding as well as roll-fed metal and polymer stock materials, with part sorting and waste removal.
Advanced Beam Delivery
LPC Systems have standard and optional beam delivery sub-systems including, beam-shaping modules/optics, trepanning heads, and high-speed dynamic focus control for critical drilling and cutting applications.
System Highlight: LPC0808FS
The LPC0808FS Laser Micromachining & Drilling Platform is a modular femtosecond laser micromachining platform engineered for high-precision microvia drilling, wafer processing, and advanced material micromachining. Designed for manufacturers requiring exceptional accuracy, automation, and scalability, the system delivers high-throughput production with minimal heat-affected zones and superior process control.
Key Features
- Ultra-precise femtosecond laser processing
- Advanced automation for increased throughput and integrated wafer handling
- Micron-level accuracy and repeatability providing high-speed galvo scanning with sub-10 µm positioning
- Scalable, modular architecture supports evolving requirements
- Designed for manufacturing ROI and long-term operational performance
System Highlight: LPC1010CO2
The LPC1010CO2 Laser Precision Cutting and Drilling Platform is a high-performance manufacturing system engineered for precision material processing in printed circuit board (PCB), flexible circuit, and advanced electronic materials manufacturing. Designed for demanding production environments, the platform combines precision motion control, machine vision, and optimized CO₂ laser processing to deliver exceptional accuracy, repeatability, and throughput.
The LPC1010CO2 performs precision drilling, skiving, cutting, trimming, milling, and selective material removal on a wide range of electronic materials, including polyimide, FR4, ceramics, ferrites, and dielectric substrates.
Key Features
- High-peak-power CO₂ laser for precision cutting and drilling
- Automated machine vision for accurate alignment and registration
- One-micron motion positioning for exceptional repeatability
- Processes FR4, polyimide, ceramics, ferrites, and dielectric materials
- CAD/CAM compatible (DXF and Excellon)
- Fully enclosed Class 1 laser safety system
- Designed for high-throughput manufacturing environments
System Highlight: LPC2424
System Highlight: LPCP1100
The Bold Laser Automation LPCP1100™ Series is a modular laser micromachining system, offering a range of laser options: IR fiber lasers, femtosecond, picosecond, excimer (193nm, 248nm, 308nm), and UV DPSS lasers (266nm, 355nm). Designed for cost-effectiveness, the system supports light to high-volume production. It can be customized with various optical beam delivery configurations to handle micromachining, drilling, large-area removal, flex circuit and PCB skiving, as well as wire stripping applications.
