Laser Automated Solder Reflow (LASR)
Reflow soldering is a controlled heating process used to form reliable electrical and mechanical connections between components and a substrate. Solder is deposited at defined locations and then heated above its melting point, allowing it to flow, wet, and bond to conductive features before solidifying. Reflow soldering is widely used in PCB assembly and high-frequency electronics because it delivers consistent joint quality, precise thermal control, and repeatable results—especially for fine features, eyelets, and dense layouts.
Benefits and Features
Laser Source Options
High-power diode lasers and fiber lasers are ideal for solder reflow due to their ability to deliver concentrated energy with high precision
Flexibility and Precision Support
Our systems deliver ±0.0015-inch laser centroid accuracy and support up to 24”x24” substrate sizes
Integrated X-Y-Z Motion Control
Includes closed-loop encoders and laser triangulation feedback for real-time focus correction.
Repeatable, High-Speed Reflow
Improves production throughput with automated verification and mapping, reducing manual alignment and ensuring multiple eyelets per second
System Highlight: LASR2424F
The LASR2424F™ system is engineered for high-precision, automated solder reflow of flat and semi-chambered substrates. Read the full press release here!
